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Description

  • This is a low temp solder paste with a no clean flux.
  • Melting Point 137C 278F (Eutectic).
  • 90% Metal Particle Size 25-45 Microns.
  • Protect Sensitive Parts with this low melting Lead Free Solder Sn42/Bi57/Ag1.
  • This alloy is better than Sn42/Bi58 because it contains Ag which makes it stronger and less brittle.
Packaged in 250 gram Jar. Shelf Life: refrigerated 12 months, unrefrigerated 6 months. Storage and Handling Refrigerate at 3-8C (37-46F). Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

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SRA Low Temperature Lead Free Solder Paste T3-250 Gram Jar

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