---
product_id: 332913477
title: "NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe"
brand: "chip quik"
price: "AED 51"
currency: AED
in_stock: true
reviews_count: 12
category: "Chip Quik"
url: https://www.desertcart.ae/products/332913477-nc191lta10-smooth-flow-low-temp-solder-paste-sn42-bi57-ag1
store_origin: AE
region: United Arab Emirates
---

# Shelf life >12 months refrigerated for long-term use Low melting point 137°C for heat-sensitive components 86.75% metal content ensures reliable conductivity NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe

**Brand:** chip quik
**Price:** AED 51
**Availability:** ✅ In Stock

## Summary

> ⚡ Solder smarter, not hotter — the future of low-temp precision is here!

## Quick Answers

- **What is this?** NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe by chip quik
- **How much does it cost?** AED 51 with free shipping
- **Is it available?** Yes, in stock and ready to ship
- **Where can I buy it?** [www.desertcart.ae](https://www.desertcart.ae/products/332913477-nc191lta10-smooth-flow-low-temp-solder-paste-sn42-bi57-ag1)

## Best For

- chip quik enthusiasts

## Why This Product

- Trusted chip quik brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Key Features

- • **Long-Lasting Freshness:** Refrigerated shelf life over 12 months means you’re always ready for your next project.
- • **Lead-Free & Eco-Friendly:** RoHS 3 and REACH compliant with halogen-free formula for safer, greener manufacturing.
- • **Versatile & Easy Cleanup:** Compatible with automated and manual stencil cleaning, saving you time and hassle.
- • **Effortless Low-Temp Precision:** Melts at just 137°C, perfect for delicate electronics and heat-sensitive components.
- • **Superior Smooth Flow™ Technology:** Engineered for optimal spread and shear, ensuring flawless solder joints every time.

## Overview

Chip Quik NC191LTA10 is a premium lead-free solder paste featuring Sn42/Bi57/Ag1 alloy with a low melting point of 137°C. Its Smooth Flow™ technology ensures superior spread and shear for precise soldering on heat-sensitive components. With 86.75% metal content and halogen-free, RoHS 3 and REACH compliance, it offers a safe, eco-conscious solution. Packaged in a 10g syringe, it boasts a refrigerated shelf life exceeding 12 months and supports both automated and manual stencil cleaning, making it ideal for professional electronics assembly and rework.

## Description

Lead-Free / RoHS 3 Compliant / REACH Compliant Description Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn42/Bi57/Ag1 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 86.75% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 137C (279F) Size: 3cc/10g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Review: Works well as low temp solder - First time using solder paste after 25+ years. Nice that it shipped with two nozzles. I did manual soldering. Needed to remember to release extra paste till see liquidish substance coming out. Spread the paste on pads, not too thick. Do not worry if it touches adjacent pads. Pressed ADXL345 LGA chip onto the pads. Used 150 deg C heat gun. The paste solder melted in a few seconds and chip just sat there. Very nice result. Never using solder for chips with funky pads. Good product.
Review: Works to remove heat sensitive components from circuit boards. - This is an excellent way to remove electronic components from heat sensitive circuit boards. You can achieve solder melt at temperatures around 300 degrees F. Just apply over top of the leads on lead or lead free solder and using a hot air rework machine bring the area up to around 300 degrees F. The solder paste will blend with the solder on the board and allow you to remove the component without excessive heat. Always re-tin the pads the original solder and wick off to remove any residue of the bismuth from the removal.

## Features

- Solder Paste

## Technical Specifications

| Specification | Value |
|---------------|-------|
| ASIN | B096BMCXHX |
| Best Sellers Rank | #84,953 in Industrial & Scientific ( See Top 100 in Industrial & Scientific ) #195 in Solder |
| Customer Reviews | 4.5 4.5 out of 5 stars (295) |
| Date First Available | June 1, 2021 |
| Item Weight | 0.353 ounces |
| Item model number | NC191LTA10 |
| Manufacturer | Chip Quik® |
| Material | metal |
| Package Dimensions | 3.9 x 2.28 x 0.67 inches |
| Part Number | NC191LTA10 |

## Images

![NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe - Image 1](https://m.media-amazon.com/images/I/41xev7hdotS.jpg)

## Customer Reviews

### ⭐⭐⭐⭐⭐ Works well as low temp solder
*by V***R on December 23, 2023*

First time using solder paste after 25+ years. Nice that it shipped with two nozzles. I did manual soldering. Needed to remember to release extra paste till see liquidish substance coming out. Spread the paste on pads, not too thick. Do not worry if it touches adjacent pads. Pressed ADXL345 LGA chip onto the pads. Used 150 deg C heat gun. The paste solder melted in a few seconds and chip just sat there. Very nice result. Never using solder for chips with funky pads. Good product.

### ⭐⭐⭐⭐⭐ Works to remove heat sensitive components from circuit boards.
*by J***. on December 22, 2025*

This is an excellent way to remove electronic components from heat sensitive circuit boards. You can achieve solder melt at temperatures around 300 degrees F. Just apply over top of the leads on lead or lead free solder and using a hot air rework machine bring the area up to around 300 degrees F. The solder paste will blend with the solder on the board and allow you to remove the component without excessive heat. Always re-tin the pads the original solder and wick off to remove any residue of the bismuth from the removal.

### ⭐⭐⭐⭐ Easy flow, breaks
*by G***G on June 7, 2023*

For an extremely gentle solder that absolute no tension will be involved…this is great. But it has broken its solder joints 8/10 times for me.

## Frequently Bought Together

- Chip Quik NC191LTA10 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe
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*Product available on Desertcart United Arab Emirates*
*Store origin: AE*
*Last updated: 2026-09-02*