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Description

  • Reduce the risk of hardware failure due to overheating..
  • Heatsink Size: 100 x 69 x 36 mm / 3.94 x 2.71 x 1.41 Inch ..
  • Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc..
  • Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer.
  • For need other sizes or oxidation of this model, contact the seller of this product model as soon as possible..
The Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. Made of high quantity aluminum, good thermal conductivity. Reduce the risk of hardware failure due to overheating. Designed to maximize its surface area in contact with the cooling air. Light weight and used in applications where weight is a big concern. Widely use for computer, power IC, power electric device, LED light devices, etc. Material: Aluminum Fin: 27 Color: Silver Size: 100 x 69 x 36 mm / 3.94 x 2.71 x 1.41 Inch Quantity: 1 Weight: 8.74 oz

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Nxtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

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