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Description

  • Leaded Solder Paste Features: No-clean, Solid after soldering, bright solder joints, not easy to connect tin, good oxidation resistance.
  • Product Information: Alloy composition Sn63/Pb37, Melting Point 183℃ (NOTE: The melting point of the solder paste, that is, to reach the temperature at which it melts, but not the temperature adjusted by the heat when welding, the specific adjustment temperature depends on the actual welding environment.).
  • Pushing design for smoother flowing, Flexible control of tin output to avoid waste. Equipped with four different sizes of needles to facilitate the needs of different use scenarios.
  • Application: Widely used in circuit boards, integrated circuits and other fields. Soldering paste for electronics, BGA, IC soldering.
  • Product Weight: 15g/0.53oz.
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Solder Paste, Sn63/Pb37 T4, Melting Point 183°C, Liquid Soldering, Soldering Paste for Electronics, BGA, SMD, IC, PCB, HDMI Repairing (15g/0.53oz)

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Disclaimer: The price shown above includes all applicable taxes and fees. The information provided above is for reference purposes only. Products may go out of stock and delivery estimates may change at any time. desertcart does not validate any claims made in the product descriptions above. For additional information, please contact the manufacturer or desertcart customer service. While desertcart makes reasonable efforts to only show products available in your country, some items may be cancelled if they are prohibited for import in United Arab Emirates. For more details, please visit our Support Page.

Frequently Asked Questions About Solder Paste, Sn63/Pb37 T4, Melting Point 183°C, Liquid Soldering, Soldering Paste for Electronics, BGA, SMD, IC, PCB, HDMI Repairing (15g/0.53oz) in UAE

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